(TMR) Processor

I/O Power Supply Chassis

19 inch x 1U chassis for up to 3 Power Packs.
Chassis Type:Main Chassis 
Input Voltage:120V AC 
Output Power:Distributes +5V DC

Trusted Expander Processor

Input Voltage: 24 VDC (Nominal)
Current Consumption: Typically 1.5 A
CPU Type: 32-bit microprocessor based 
Operating Temperature: 0°C to +60°C (32°F to 140°F)
Storage Temperature: -40°C to +85°C (-40°F to +185°F)

CHASSIS TRUSTED CONTROLLER

CHASSIS TRUSTED CONTROLLER
Architecture:3-channel TMR
Safety Certification:SIL 3 (IEC 61508/61511)
Slots:12 slots
Backplane Bandwidth:100 Mbps dual-redundant TMR bus
Input: 24V DC (18–32V range)
Redundancy: N+1 hot-swap PSUs
Per PSU: 250W @ 24V DC

PROCESSOR MODULE

T8110B
DISCONTINUED BY MANUFACTURER
PROCESSOR MODULE
TRUSTED TMR
IRIG-B002 AND 122 TIME SYNCHRONISATION SIGNALS
TWO RS422/485 2/4 WIRE CONNECTIONS
ONE RS485 2 WIRE CONNECTION

Trusted 24 Vdc Digital Input Module

Voltage Range: 18–30 Vdc
Input Impedance: Typically 3–5 kΩ 
Number of Channels: 8 or 16 channels
Response Time: ≤ 10 ms 
Operating Temperature: -40°C to +70°C
Backplane Power: 24 Vdc
Power Consumption: 2–5 W

Trusted TMR Expander Interface

Voltage Range : 20 to 32V dc
Heat Dissipation : 40W
Use with Chassis : T8300
Maximum Load : 40W
Module Clocks : 50MHz
Expander Bus Data Rate : 250Mbps
Manufacturer : ICS Triplex
I/O Interface : Expander Chassis backplane
Operating Temperature : -5°C to 60ºC (13°F to 140°F)
Non-operating Temperature : -25°C to 70ºC (-25°F to 158°F)
Operating Humidity : 5 to 95% RH

Communications Interface Module

Power Supply: +24V DC
Power Consumption: 5 Watts maximum
Operating Temperature: -40°C to +70°C
Storage Temperature: -40°C to +85°C
Humidity: 5% to 95% non-condensing
Vibration: 0.03 g rms per axis, 5 to 500 Hz
Shock: 15 g, half-sine, 11 ms duration