









CPU module
Operation 0° to 55°C
Transportation/storage 40° to 85°C (*1)
Dust 0.3 mg/m3 or less
Resistance to corrosive gases
ANSI/ISA S71.04 Class G2 (Standard)
(ANSI/ISA S71.04 Class G3, option)
Resistance to vibration
0.15 mm P-P (5 to 58 Hz), 1 G (58 to 150 Hz)
Resistance to shock
15 G, 11 ms
(during power-off, for sine half-waves in XYZ-directions)
Altitude 2000 m or less
CPU module
High-performance
high-elibility modular controller
Memory with ECC
Low heat dissipation eliminates the need for a fan
Awealth of RAS features -CPU self-diagnostics
temperature monitoring. 1/0 diagnostics, and more
power supply module, local bus (SB bus)
and control network can all be duplexed
and all modules are hot-swappable
Can function as link active schedulers
(L ASs) for low-speed voltage mode (H1)
FOUNDATION Fieldbus segments
and link up FOUNDATION Fieldbus-enabled feld devices
CPU module
Processor Atom E3815 1.46 GHz
Main 256 MB with ECC
Static RAM 2 MB with ECC
backed up by battery
1 GB on-boad flash memory
SDHC (4 to 32 GB) Class 10
D-sub 9 pins, male (*2)
Full/Half duplex (software settings)
Synchronisation Asynchronous
4 Ethernet ports : RJ45 modular jacks
CPU module
Processor Atom E3815 1.46 GHz
Main 256 MB with ECC
Static RAM 2 MB with ECC
backed up by battery
1 GB on-boad flash memory
SDHC (4 to 32 GB) Class 10
D-sub 9 pins, male (*2)
Full/Half duplex (software settings)
Synchronisation Asynchronous
Axis Control Card
operating 0 to 60°C ambient
storage -40 to 85°C
Humidity 5% to 95% non condensing
Altitude 10,000 ft (3,000 m)
Vibration 0.015 inch (0.38 mm)
Peak to Peak displacement with 2.5 g peak (max)
accelerationover 5 to 2000 Hz
Shock 0 g, 11 ms duration, half-sine shock pulse
Current +5V @ 0.30A
PSU3400 POWER SUPPLY
SITOP PSU3400
24 V/10 ASITOP PSU3400
24 V/10 A Stabilized power supplies
Input: DC 24 V(18...32 V)
Output: DC 24 V/10 A
Control board
Mechanical rigidity: flexibility
Layers: Multiple layers
Substrate: Aluminum
Insulation material: metal based
Insulation layer thickness: Conventional board
Flame retardant properties: VO board
Processing technology: electrolytic foil
Reinforcement material: fiberglass cloth base
Edge resin: Epoxy resin (EP)
Control board
Mechanical rigidity: flexibility
Layers: Multiple layers
Substrate: Aluminum
Insulation material: metal based
Insulation layer thickness: Conventional board
Flame retardant properties: VO board
Processing technology: electrolytic foil
Reinforcement material: fiberglass cloth base
Edge resin: Epoxy resin (EP)

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