Backplane (IMB) Supply:20 Vdc to 32 Vdc
Power Dissipation:30 W
Maximum Application Size:960 KB
SOE Buffer:1000 events
Operating Temperature:0 °C to 60 °C (+32 °F to +140 °F)
Storage Temperature: -25 °C to 70 °C (-13 °F to +158 °F)
Allows easy access for external systems
to communicate with a Trusted System
Easy installation i.e. connects directly to the back of the Trusted Communication Interface.
Two 10/100BaseT connections.
Four RS422/485 connections.
Two RS232 connections
Input Voltage: 24 VDC (Nominal)
Current Consumption: Typically 1.5 A
CPU Type: 32-bit microprocessor based
Operating Temperature: 0°C to +60°C (32°F to 140°F)
Storage Temperature: -40°C to +85°C (-40°F to +185°F)
Input Voltage: 24 VDC
Operating Temperature: Typically 0°C to +60°C (32°F to 140°F)
Storage Temperature: -40°C to +85°C (-40°F to 185°F)
Humidity: 5% to 95% relative humidity
T8110B
DISCONTINUED BY MANUFACTURER
PROCESSOR MODULE
TRUSTED TMR
IRIG-B002 AND 122 TIME SYNCHRONISATION SIGNALS
TWO RS422/485 2/4 WIRE CONNECTIONS
ONE RS485 2 WIRE CONNECTION
Voltage Range: 18–30 Vdc
Input Impedance: Typically 3–5 kΩ
Number of Channels: 8 or 16 channels
Response Time: ≤ 10 ms
Operating Temperature: -40°C to +70°C
Backplane Power: 24 Vdc
Power Consumption: 2–5 W
Voltage Range 14 to 30 VDC
Turn-On Voltage 12 VDC, min
Turn-Off Voltage 4.7 VDC, max
Input Current 8.7 mA
continuous: 50 VAC
burst:80 VAC, for5 sec
Heat 10 Watts
Dissipation 34 BTUs/hour
Power Supply: +24V DC
Power Consumption: 5 Watts maximum
Operating Temperature: -40°C to +70°C
Storage Temperature: -40°C to +85°C
Humidity: 5% to 95% non-condensing
Vibration: 0.03 g rms per axis, 5 to 500 Hz
Shock: 15 g, half-sine, 11 ms duration
